Shrink-Fits Assembly
Assembly temperatures for shrink-fits. Calculate required heating temperature or diametric interference for shrink-fit assemblies using thermal expansion principles.
Shrink-Fits Assembly
Shrink-fits are assembled by heating them to temperatures where the expansion exceeds the interference. Required heating temperature can be calculated as:
Formula (1): Temperature Heating
dt = δ / (α × di)
Formula (2): Diametric Interference
δ = dt × α × di
Where:
- dt = temperature heating (°C, °F)
- δ = diametric interference (mm, in)
- α = coefficient of linear expansion (m/m·K, in/in·°F)
- di = initial diameter of hole before expansion (mm, in)